Skorpios and Murata Manufacturing showcase concept samples of Industry’s most advanced AI Optical Interconnect Engine

TEMECULA, CA, UNITED STATES, March 31, 2025 /EINPresswire.com/ -- Skorpios Technologies, a leader in integrated silicon photonics and heterogeneous silicon nanostructures, today announced a roadmap for 1.6 Tbps and 3.2 Tbps photonic integrated circuits (PICs) and Optical Engine (OE) solutions, delivering the most advanced, cost-effective, high-speed AI and high-performance compute (HPC), and data center optical interconnect solutions in the industry.

These next-generation PIC and OE products will be on display at the Optical Fiber Communication Conference and Exhibition (OFC) at the Moscone Center in San Francisco from April 1 – 3, 2025.

The concept sample from Murata Manufacturing is an Optical Engine (OE) that integrates Skorpios’ 1.6 Tbps DR8 Tx Heterogeneous PIC, Driver IC, HPIC, and optical/electrical connectors, into a compact, high-performance solution, packaged on Murata’s proprietary LTCC (Low-Temperature Co-fired Ceramic) boards for superior thermal management, performance and reliability.

This novel integration delivers:
- Skorpios’ Propietary TruSiph™ Heterogeneous Integration Technology enabling high-performance and low-cost optoelectronic devices
- Detachable electrical and optical connectors for seamless integration and scalability
- Silicon-matched CTE for superior reliability
- Low Thermal Impedance: for superior thermal management

Today, Silicon Photonics and PIC-based transceivers are at the heart of the AI, HPC, and communication infrastructure transformation, offering high-speed, power-efficient, and cost-effective data transmission at speeds of 1.6 Tbps and beyond. Recognizing this explosive growth in AI-driven networking, Skorpios is investing in next-generation optical interconnect solutions.

Experience the Future of AI & Optical Interconnects at OFC 2025
Skorpios and Murata will showcase their latest silicon photonics-based transceivers and Optical Engine solutions at the OFC Conference in San Francisco, CA, from March 30 to April 3, 2025.
Visit booth #5065 in the North Hall of Moscone Convention Center to see how these innovative Silicon- Photonics CPOs, pluggables, and chip-to-chip GPU interconnects are revolutionizing high-speed computing and AI infrastructure optical connectivity.

About Skorpios Technologies
Skorpios Technologies is a leader in Silicon Photonics and advanced semiconductor fabrication, delivering next-generation solutions for AI infrastructure, hyperscale networking, HPC interconnects, optical transport networks, LiDAR, aerospace, and quantum computing. The company’s proprietary Tru-SiPh™ heterogeneous integration platform embeds lasers and III-V materials directly into silicon, redefining photonic performance, scalability, and cost-efficiency.
In addition to its revolutionary 1.6 Tbps photonic integrated circuits (PICs), Skorpios offers comprehensive test-wafer services and high-volume foundry services, supporting the development and manufacturing of cutting-edge semiconductor and optical solutions. The company’s state-of-the-art Temecula-based fab enables 2.5D and 3D packaging, co-packaged optics, and customized integration for hyperscalers, networking vendors, AI accelerators, and semiconductor leaders.

To learn more about Skorpios Technologies, visit www.SkorpiosInc.com.
To learn more about Murata Manufacturing, visit www.murata.com.

Gunter Reiss
Skorpios Technologies
+1 408-799-7097
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